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据韩联社23日报道，韩国科技评估与规划研究院（KISTEP）当天发布的一份调查报告显示，韩国绝大多数的半导体技术已经被中国赶超。
报道称，KISTEP针对39名韩国国内专家实施问卷调查的结果显示，截至去年，韩国所有半导体领域的基础力量均落后于中国。若将技术最先进国家的水平设为100%，韩国在高集成度、低阻抗存储芯片技术领域成就为90.9%，低于中国（94.1%），位居第二；在高性能、低功耗的人工智能芯片领域，韩国（84.1%）仍不及中国（88.3%）。
报道称，在功率半导体方面，韩国为67.5%，中国高达79.8%；新一代高性能传感技术方面，韩中两国分别为81.3%和83.9%；半导体先进封装技术方面，两国均为74.2%。
报道提到，站在商业化的角度来看，韩国仅在高集成度、低阻抗存储芯片和先进封装技术方面领先于中国。值得关注的是，参与此次调查的专家曾在2022年时认为韩国在高集成度、低阻抗存储芯片、先进封装、新一代高性能传感技术等方面均领先中国，但仅两年就改变了看法。
韩联社援引调查报告结果称，韩国虽在制造工艺和量产方面领先中国，但在基础技术和设计领域落后。日本和中国的崛起、美国的制裁、东南亚市场增长等因素给产业带来了不确定性。
